Semiconductor Packaging & Encapsulation

Semiconductor, Electronics & LED Systems

Products and Applications

Semiconductor, Electronics & LED Systems

This includes molding compounds, protective layers, and internal package materials that surround and protect semiconductor devices.

NITRAXA®

Used inside packaging systems to keep thermal and electrical behavior stable as temperatures change.

SPHEREXA®

Used within compounds to control stress distribution, reducing crack initiation and package distortion.

PLASTEXA®

Used to improve flow, consistency, and defect control during molding and encapsulation.

ASPIREXA®

Used where a balance of mechanical stability and easy processing is required across multiple package designs.

Product Name	Product Description	Datasheet	SDS
NITRAXA^®	A high-temperature ceramic material platform engineered to enhance oxidation resistance and hot mechanical strength. It stabilizes ceramic systems under aggressive thermal and chemical environments, extending service life and reliability.
SPHEREXA^®	A ceramic reinforcement platform engineered to promote uniform stress distribution and reduce localized stress concentration. It improves crack resistance and reliability under thermal cycling and mechanical loading.
PLASTEXA^®	A low-volatility, dispersion-friendly carbon black series developed for clean processing, low odor and stable rheology. It delivers consistent colour and smooth surfaces across sensitive and regulated applications in plastics, rubber, coatings and inks.
ASPIREXA^®	A balanced-performance material platform engineered to deliver stable mechanical, thermal, and processing behavior. It supports manufacturing robustness and long-term reliability across complex electronic and ceramic systems.

Learn more about the technical specifications and properties of our products.

Get detailed safety and compliance information for our products.

Get in touch with our team for sales, support, and inquiries.