Substrates and ceramic components carry heat away from devices while keeping electrical isolation intact. This is critical in power devices, LEDs, and advanced electronics.
Industry Problems with Conventional Grades
Heat buildup causing early device failure
Electrical leakage risks at elevated temperatures
Cracking or warpage during thermal cycling
Interface degradation over time
How iSTAR solutions are used
NITRAXA®
Forms the core of stable thermal pathways that move heat efficiently while maintaining electrical integrity.
SPHEREXA®
Used to improve dimensional stability and interface reliability between substrate layers
ASPIREXA®
Applied where manufacturers need consistent performance without narrowing the processing window.
TDS
Learn more about the technical specifications and properties of our products.
SDS
Get detailed safety and compliance information for our products.
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